Nano surface roughness and shape measuring instrument "Nano Seven TN-A1"
TN-A1 Nano Roughness Height Profile Measurement Device
Ideal for wafer inspection! Measures surface roughness and shape at the sub-nanometer level.
The "Nano Seven TN-A1" is a nano surface roughness and shape measurement device suitable for wafer inspection. It can be installed near polishing machines for full inspection. Due to its non-contact measurement using lasers, it does not come into contact with the measurement target. Additionally, it employs phase difference measurement using optical heterodyne interference, which is based on the wavelength of light, allowing for a height direction resolution of 0.1 nm and achieving measurement results compatible with AFM. 【Features】 ■ Shortened measurement time ■ Low price setting ■ No need for vibration isolation table ■ Non-contact measurement ■ Capable of wide range measurements ■ Easy operation ■ High resolution *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Product Specifications】 ■ Measurement Method: Optical Heterodyne Interferometry ■ Height Resolution: 0.1nm ■ Reference Height Measurement Range: 0.5 to 300nm ■ Standard Travel Distance: X-axis 25mm / Y-axis 25mm ■ Light Source: Red Laser (633nm) ■ Objective Lens: Magnification 20x, NA 0.4 ■ Main Body Dimensions: W313×D614×H428 ■ Main Body Weight: Approximately 27kg ■ Software: LabVIEW ■ Clamp Fixture: Conductive PET 180×180mm *For more details, please refer to the PDF document or feel free to contact us.
Price information
It may vary depending on the options, so please feel free to contact us.
Price range
P6
Delivery Time
Applications/Examples of results
【Purpose】 ■Wafer inspection *For more details, please refer to the PDF document or feel free to contact us.
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Company information
We realize a creative system from the design and development stage to manufacturing, centered around the theme of "products that customers demand," and we are also committed to flexible manufacturing as a pioneer of specialized products. On the other hand, we are actively expanding our exports overseas, focusing on sales to countries such as the United States and Germany. Moving forward, we will anticipate increasingly diverse technologies and engage in product development for laser application peripheral devices, prioritizing S (Speed), Q (Quality), and C (Cost) to provide reasonable products.
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