Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.
Inquire About This Product
basic information
【Specifications】 ○Joining method: Paste/Thermal compression ○Bonding method: Direct/Intermediate stage ○Die size: 0.8mm-25mm (Direct) 3.5mm-20mm (Intermediate stage) ○Wafer size: Φ200mm/Φ300mm ○Substrate/Lead frame size →Length: 150-300mm →Width: 38-100mm →Thickness: 0.1-0.6mm ○Magazine size →Length: 150-305mm →Width: 38-120mm →Height: 60-150mm ○Bonding accuracy (3σ) →DAF: XY=10um/Θ0.1deg →Paste: XY=20um/Θ0.5deg ○Equipment size →Overall width: 2050mm →Depth: 1300mm →Overall height: 1550mm ○Weight: 2080Kg ●For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（1）
Download All Catalogs
Company information
Fasford Technology Co., Ltd. originated from the Semiconductor Division of Hitachi, Ltd. and took a new step forward on March 16, 2015, focusing on the bonding equipment business. "Everything is for the success of our customers" is our goal and philosophy. To achieve that success, we adhere to the principles of a "Win-Win-Win" relationship with our customers and partners, as well as "SPEED." Each employee cherishes a spirit of gratitude and strives daily with the world's best technological capabilities and customer service, while also continuously challenging themselves and aiming for further growth without being constrained by the changes of the times.
![[Research Material] Global Market for Semiconductor Assembly Process Equipment](https://image.mono.ipros.com/public/product/image/51e/2001456883/IPROS16332850475457528683.jpeg?w=280&h=280)
![[Research Material] Global Market for Semiconductor Assembly Equipment](https://image.mono.ipros.com/public/product/image/af3/2001476177/IPROS55883798478253534179.jpeg?w=280&h=280)
