For small and medium devices! Industry-leading performance in flip chip bonding.
The "AFM-15" is a flip chip mounting system ideal for small to medium-sized devices. We have identified the needs of production sites from the customer's perspective and turned them into products. This system realizes ideals such as high speed, high reliability, space-saving, and low cost. Additionally, we also offer the "MDM-50," which is optimal for high-precision, small-quantity, and quantitative coating applications. 【Features】 ■ High speed ■ High reliability ■ One of the smallest device sizes in the industry ■ Low-energy bonding ■ Compatible with 12-inch wafer supply *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Lineup】 ■AFM-15 ・1505 ・1506 ・1561 ■MDM-50 *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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Company information
TDK Corporation is a company that primarily develops and commercializes devices such as magnetic heads, magnets, power supplies, and batteries. Our main products are passive components, including ferrite cores, coils, transformers, ceramic capacitors, and sensors, which are fundamental components used in all electrical and electronic devices. Currently, we are engaged in product development and commercialization based on the technologies and know-how we have accumulated and refined in these areas.
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