It is a handling device for non-contact transportation of semiconductor silicon wafers, such as glass.
"Hiseshsho-kun" is a handling device for non-contact transportation of semiconductor silicon wafers, such as glass. The suction part of "Hiseshsho-kun" does not come into contact with the transported items like wafers, and they are transported in a floating state with air in between. "Hiseshsho-kun" solves the following problems: * Cross-contamination * Damage or scratches on wafers * Handling of ultra-thin wafers * Point contact retention of wafers * Wafer transportation mechanism * Wafer levitation
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basic information
Advantages of "Hisesusho-kun": → Maintains without contact → Low cost → Strong holding power → Low consumption flow → Engineering
Price range
Delivery Time
※It varies depending on the customer's specifications.
Applications/Examples of results
It is a handling device for non-contact transport of semiconductor silicon wafers, such as glass.
Company information
Sasaki Koki Co., Ltd. develops, designs, manufactures, and sells systems that combine automation and labor-saving machinery for general industrial machinery equipment. We handle everything from the design of various machinery to production, assembly, adjustment, and installation. We specialize in pneumatic devices and offer machine control through all-air control. We accommodate everything from single prototypes to mass production, including post-processing such as hardening, polishing, plating, and painting, with workpiece sizes ranging from less than 1 millimeter to over 3 meters for large items.
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