Thermal conductive gap filling material for electronic components TGP HC5000

Henkel Japan Corporation's Electronics Division, a Japanese subsidiary of the German chemical and consumer goods manufacturer Henkel, will exhibit at the "9th International Car Electronics Technology Exhibition" (Dates: January 18-20, 2017, Venue: Tokyo Big Sight) and will unveil new products from its thermal management brand BERGQUIST for the first time. At the Henkel Japan booth, the focus will be on the two-component, thermally conductive gap filling material: Gap Filler, which can be applied using a dispenser. The booth will showcase the extensive adoption record of BERGQUIST thermal management products, a diverse lineup including development products, and new sheet-type gap filling material: Gap Pad HC5.0. Demonstrations of the dispenser equipment and hands-on application experiences with air guns will be conducted regularly, providing a total solution that encompasses not only product selection but also the manufacturing process. Additionally, the booth will introduce conductive adhesives, underfill materials, and Technomelt sealants for automotive applications, which are used in a wide range of car electronics and sensor components, including common rail fuel systems, safety devices, engine and powertrain management, infotainment, and lighting.

■Development Background As electronic components become smaller, their power density has increased, leading to a greater demand for thermal management. Components and substrates used in infrastructures that utilize the Internet and computers require excellent thermal conductivity, which is why we developed Gap Pad HC 5.0. By using Gap Pad HC 5.0, it is possible to lower the junction temperature and improve the performance of devices. This product is a thermally conductive gap filling material designed for next-generation applications with high power density. ■Features Gap Pad HC 5.0 is a gap filling material with a thermal conductivity of 5.0 W/m·K. In addition to its high thermal conductivity, it is characterized by high shape conformity and low compressive stress. It exhibits excellent thermal properties even under low loads, making it suitable for applications where it is necessary to minimize stress on components and substrates during assembly. Furthermore, it maintains shape conformity even on surfaces with significant roughness or height differences, achieving quick shape recovery and excellent wettability.