Achieved an optical resolution of 0.7µm!
In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.
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basic information
【Fine Tech's Solutions】 ○ High-precision die bonding requires accurate magnification and resolution. If either is lacking, achieving sub-micron implementation becomes impossible. ○ If only high magnification is achieved, the alignment image will be a blurred (magnified noise signal) image, and reproducibility will not be maintained. ○ Conversely, with low magnification and high resolution, the alignment image will be very small, making high-precision implementation nearly impossible. ○ Fine Tech's die bonders utilize top-quality optical technology with precise magnification and advanced resolution, providing sharp alignment images necessary to achieve sub-micron accuracy.
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○FINEPLACER Series High-Precision Die Bonding Equipment The high-precision die bonding equipment of the FINEPLACER series flexibly accommodates various mounting applications through the adoption of a modular system.
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.