Stainless steel smartphone camera module parts - ultra-fine blanking processing case study.
Ultra-fine cutting processing with a tolerance of 5μm or less. Achieving a diameter tolerance of ±5μm.
[Smartphone Camera Module Parts Processing Examples (with Photos)] - Flatness: less than 5μm - Switch from etching - Diameter tolerance: ±5μm - Press-in-line automatic alignment packaging to prevent deformation Material: Stainless steel Material thickness: 0.05mm Application: Camera module parts (smartphones) In Misuzu Industry's precision parts business, we utilize the technology of press processing (metal and non-metal) for ultra-small and thin parts, cultivated through the manufacturing of watch components, to perform fine and complex shape cutting, bending, and drawing processes that were previously impossible with conventional pressing. Our integrated manufacturing system, from mold design and production to press processing and surface treatment, enables us to achieve micron-level shape and precision orders from customers, meeting diverse needs. *For details, please contact us directly.
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【Material】 Stainless steel 【Thickness】 0.05mm 【Usage】 Camera module parts (smartphone)
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Camera module parts (smartphone)
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In the precision parts business, we have achieved the processing technology for ultra-small and thin parts through press processing (metal and non-metal) developed in the manufacturing of watch components, along with a consistent in-house manufacturing system that encompasses mold design and production, press processing, and surface treatment. This allows us to realize fine and complex shapes that were previously considered impossible with conventional pressing, including cutting, bending, and drawing techniques. We shape micron-order geometries and precision while responding to our customers' diverse needs. In the precision assembly business, we leverage our long-standing high-precision and high-density bare chip mounting technology, primarily focusing on reel-to-reel FPC mounting, enabling us to provide consistent support from dicing to final testing and sub-assembly.
