Diamond wheel "USM" for machining hard and brittle materials *suitable for high-precision processing.
Ideal for high-speed and high-precision processing of hard and brittle materials such as glass for LCDs, quartz, and sapphire!
The diamond wheel 'USM' for processing hard and brittle materials is a porous metal bond suitable for high-speed and high-precision processing of LCD glass, quartz, sapphire, and more. It has a high abrasive grain retention capability and generates a good bond tail on the grinding surface. The bond tail effectively promotes the discharge of grinding debris, enhances coolant supply capacity, and increases the amount of abrasive penetration, leading to improved grindability. 【Features】 ■ Suitable for high-speed and high-precision processing ■ High grinding performance due to a bond matrix with ultra-fine pores at the micron level *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
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Lead Co., Ltd. is committed to contributing to the realization of humanity's dreams in the field of ultra-precision machining, which serves as the foundation for next-generation industries. We continue to strive for the development of untapped technologies. Today, high technology is advancing based on electronics, progressing towards high-speed and high-capacity software, computers, and communication devices. Its applications are making remarkable strides in robotics, process technology, and the aerospace industry, extending even to cutting-edge nanotechnology. In this next-generation industry, which is moving towards knowledge-intensive fields, the research, development, and practical application of new materials, led by fine ceramics, have made significant progress, and the corresponding advancement of processing technologies is urgently needed. Please pay attention to Lead's power as we take on the challenges of the world of nanotechnology.
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