Waterproof sealing of the substrate: Achieving cost reduction as an alternative to two-component potting.
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.
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basic information
Our company provides comprehensive technical support under the customer-first philosophy, from product shape design, prototype mold design and manufacturing, prototype evaluation, process proposals during mass production, to molding equipment design and manufacturing, and mass production startup support. Our in-house technical sales staff utilize their extensive experience, which spans hundreds of cases, along with technologies such as 3D-CAD design, custom-developed flow analysis, and residual stress analysis to make optimal proposals.
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Applications/Examples of results
- Automotive seat sensor - Automotive belt buckle sensor - Automotive power window switch - Automotive control board - Sealing of motor stator - Sealing of antenna coil - Waterproof sealing of IoT devices etc.....
Detailed information
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Example of waterproof sealing for agricultural machinery substrates. The left photo shows before sealing, and the right photo shows after sealing (the black part is the hot melt molded section).
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Example of encapsulation for industrial equipment circuit boards. The left photo shows before encapsulation, and the right photo shows after encapsulation (the black part is the hot melt molded section).
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Example of waterproof sealing for motor stators. The amber-colored part covering the circuit board and the area around the coil in the photo is the hot melt molding section.
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Company information
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.