We achieve cost reduction as an alternative to potting. We have summarized the waterproof sealing process using the notable electrical component sealing technology "hot melt molding" in a one-minute video. Please take a look.

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

Numerous examples of achieving value analysis (VA) by replacing the two-component potting process with hot melt molding are published! This is a technical case study document summarizing these examples from a process perspective. ■ Currently, we are offering technical documents and various case studies for free! ■ 【Published Information】 ■ Differences between potting and hot melt molding ■ Process flow implementation - Potting process ■ Process flow implementation - Hot melt molding ■ Application 1: Waterproof sealing of LED fixtures ■ Application 2: Waterproof sealing of micro switches ■ Application 3: Waterproof sealing of temperature sensors

• Other electronic parts
• Other polymer materials
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

We introduce the adoption of hot melt molding technology that demonstrates excellent sealing performance by directly injecting sustainable hot melt adhesives made from natural fatty acids into electronic components. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in the number of components 2. Reduction in the amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog. ◆ If you would like a sample of the actual product, please contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

The MK520 is a low-pressure molding machine specifically designed for hot melt applications. By adopting a shuttle stage, it allows for molding to be performed in parallel with work set and work retrieval operations, achieving high productivity. Additionally, the injection system does not use heat hoses, which can cause material degradation and pressure loss, enabling precise injection control. 【Features】 ■ Excellent production capacity ■ Hose-free heating ■ Low cost ■ Parts procurement and assembly completed within China ■ Uses reliable OMRON products for PLC/HMI *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Molding Equipment
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for sealing electrical components against water.

The "MK600" is a compact low-pressure molding machine dedicated to hot melt, with a footprint of 900×1,200 mm. By eliminating heat hoses, which can cause material degradation and pressure loss, it establishes excellent productivity. It is covered on three sides (back and sides), and an area sensor is installed on the operator's side. By completing parts procurement and assembly within China, we have achieved an astonishing price for a dual gear pump type discharge mechanism. 【Features】 ■ Excellent safety ■ Hose-free ■ Low cost ■ Compact size ■ Uses reliable OMRON products for PLC/HMI *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Molding Equipment
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

The "MK700H" is a dedicated low-pressure molding machine for hot melt, with the maximum mold dimensions expanded to 300×200×150 (mm) and an enhanced clamping force of 75kN. This allows for the molding of larger insert works and molds with a high number of cavities, which were difficult to mold with the "MK600" and "MK520." By completing parts procurement and assembly within China, it achieves an astonishingly low price despite using a dual gear pump type for the discharge mechanism. By separating the workstation and melter, it also allows for customization, such as adding an injection nozzle. 【Features】 ■ Supports large area products ■ Low cost ■ Uses reliable OMRON products for PLC/HMI ■ High layout flexibility *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Molding Equipment
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

• Other electronic parts
• Other polymer materials
• Coating Agent

Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

• Other electronic parts
• Processing Contract
• Coating Agent

We are pleased to announce that Tokyo Machine Works Co., Ltd. will be exhibiting at the "INNOVATION EXPO 2025" to be held at Tokyo Big Sight from September 10 (Wednesday) to September 12 (Friday), 2025. 【Exhibited Equipment】 - 1-ton portable autonomous mobile robot (AMR) - 2-ton portable unmanned transport vehicle (AGV) - Shutter-equipped unmanned transport vehicle - Autonomous cleaning robot, etc. 【Booth Number】 - 6-405 You will have the opportunity to see each machine up close, including demonstrations that link the equipment together. We sincerely look forward to your visit during this event. Please note that pre-registration (free of charge) is required to attend the exhibition, so we kindly ask you to register using the link below. https://www.logistech-online.com/jp/registration.php?exhibitor=EX000072 If you would like an invitation, please request it through our contact form.

Contec has added a BTO menu for the Windows 11-based embedded OS - Windows 11 IoT Enterprise LTSC 2024 to its industrial computer "MR4310 series" and has started accepting orders.

Contec has developed the Ethernet wireless converters "RP-WAH-SR12" and "RP-WAH-SR22," which utilize 920MHz sub-gigahertz wireless (IEEE 802.11ah) to enable Ethernet communication wirelessly even at distances of up to 1 km. Sales began on August 21, 2025. The new products are compact IEEE 802.11ah compliant wireless LAN converters that can be installed in various locations. The new Wi-Fi standard "IEEE 802.11ah," which utilizes sub-gigahertz wireless communication, became available in Japan in September 2022. It operates in the 920MHz band without the need for a license and can be used outdoors. Compared to conventional 920MHz wireless communication, it enables high-speed communication and the establishment of long-distance networks, making it expected to be utilized in large factories, plants, and farms. The new Ethernet wireless converters are designed to be lightweight and compact, allowing for installation in various locations such as walls and DIN rails with the included mounting brackets. Additionally, they support external antennas, enabling the construction of flexible wireless LAN systems.

Contec has developed a super compact business computer equipped with the Intel(R) Core(TM) Ultra processor (Series 1), and has started accepting orders for the business computer "LPC-500 Series" (hereinafter referred to as the new product) from August 28, 2025. The new product is a super compact business computer featuring the Intel(R) Core(TM) Ultra 5 processor 125U (Series 1, Meteor Lake-U). It is equipped with "Intel(R) AI Boost," which integrates an NPU into the CPU, allowing for the execution of AI functions such as image recognition and voice processing at high speed and low power consumption while reducing the load on the CPU and GPU. With ultra-compact dimensions of 150(W) × 150(D) × 33(H) mm, it comes with a vertical stand and VESA mounting brackets, enabling installation in tight spaces on desks, behind displays, or inside equipment without restriction. It adopts a BTO (Build to Order) method that allows customers to freely choose memory capacity, storage, OS, and more, enabling the order of a PC with specifications optimal for their needs and budget starting from just one unit.

Thank you very much for your continued support. We would like to inform you that our company will suspend product shipping operations for inventory purposes due to the interim financial closing on the following dates. We apologize for any inconvenience this may cause and appreciate your understanding. Shipping suspension period: Tuesday, September 30, 2025.