Structural analysis of LED encapsulants using thermal decomposition GC/MS method.
Epoxy resin is excellent in heat resistance, chemical resistance, and insulation properties, and also has high mechanical strength, making it suitable for various applications such as insulation materials for electronic devices, adhesives, paints, and construction materials. However, due to the lack of solvent solubility, the analytical methods for structural determination are limited. This case presents an example of thermal decomposition GC/MS measurement of epoxy resin used as a sealing material for LEDs. The thermal decomposition products reflecting the structures of the main agent and curing agent were obtained, and this resin was estimated to be a bisphenol A/anhydride type epoxy resin.
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Analysis of lighting and display.
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!