Integration of processing into a unified device! A laser system that improves production efficiency through automatic cutting.
The thin film patterning device "FILM LASER" is specialized for thin film removal processing on various substrates such as glass and resin. Upon request, the maximum processing area size can be up to 800mm x 800mm, and it can accommodate fine patterns with a line and space of 20μm/20μm. It also supports roll-to-roll device integration. 【Features】 ■ Processing range: 800mm x 800mm (customizable) ■ Line & space: 20μm/20μm ■ Mass production speed: 5,000mm/s ■ Integration of roll-to-roll, loader, and unloader processing ■ Improved production efficiency through automatic cutting For more details, please refer to the catalog or feel free to contact us.
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basic information
Main Specifications ■ Equipped with solid-state laser *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Application】 ■Removal of thin films such as Ag, ITO, Cu, MoAIMo on glass/film, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
Delphi Laser Japan Co., Ltd. engages in equipment sales, equipment development, laser processing, maintenance, and more in the Japanese market. The headquarters, Delphi Laser, is a joint venture between China and Australia, focusing on the development, manufacturing, and sales of laser equipment applied in various high-end industries. In particular, devices equipped with ultraviolet lasers and ultrashort pulse lasers leverage the characteristics of laser microprocessing and are widely applied in the precision microprocessing fields of solar cells, LEDs, LCDs, touch panels, and more.
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