COF implementation service: Supporting film design, procurement, implementation, and reel shipment.
We perform high-precision mass bonding of bare chips to flexible printed circuit boards (FPC). We can provide integrated support from film design and procurement to assembly and reel shipment.
COF implementation allows for bulk bonding even with multiple pins, and connections can be made in a short time. Furthermore, compared to TCP, it is possible to accommodate finer bonding pitches. Additionally, since film bending is possible, flexible placement is achievable. We provide a consistent line setup from dicing to electrical characteristic testing.
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basic information
(Wafer: supplied by the customer) → Dicing → (Film: design and in-house procurement) → Inner lead bonding → Underfill → Marking → Testing → Visual inspection → Editing and packing → Shipping
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Applications/Examples of results
Display devices such as liquid crystal panels
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Company information
In the precision parts business, we have achieved the processing technology for ultra-small and thin parts through press processing (metal and non-metal) developed in the manufacturing of watch components, along with a consistent in-house manufacturing system that encompasses mold design and production, press processing, and surface treatment. This allows us to realize fine and complex shapes that were previously considered impossible with conventional pressing, including cutting, bending, and drawing techniques. We shape micron-order geometries and precision while responding to our customers' diverse needs. In the precision assembly business, we leverage our long-standing high-precision and high-density bare chip mounting technology, primarily focusing on reel-to-reel FPC mounting, enabling us to provide consistent support from dicing to final testing and sub-assembly.