TDS analysis of low melting point metals
Sn is used as the main raw material for solder, which is also used in semiconductor manufacturing. The gases in the solder can cause void formation, so it is important to control the amount of encapsulated gas in the solder and its main raw material, Sn. The results of investigating the gases released by heating Sn to a temperature above its melting point using TDS analysis are shown below. By heating the sample above its melting point, it is possible to evaluate the surface-adsorbed components and the components of the encapsulated gas in the sample.
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Analysis of manufacturing equipment and components.
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Download All Catalogs![[Analysis Case] Metal (Sn) Thermal Desorption Gas Analysis_C0458](https://image.mono.ipros.com/public/catalog/image/01/de6/365856/IPROS3610509954976747836.jpg?w=120&h=170)
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!