The metal "centrifugal powder manufacturing device" has numerous achievements in solder powder production. *Technical brochures are currently being distributed.
Centrifugal powder manufacturing equipment that realizes the production of spherical powders of high melting point metals! It is also capable of producing high-quality powders with low oxygen content. Powder particle sizes can range from 5 μm to 350 μm!
The "metal powder manufacturing device" utilizes centrifugal force to drop molten metal onto a disk attached to a high-speed motor, producing spherical powder. It has been designed to accommodate high melting point and fine powders. We can meet customer requests such as "I want to produce spherical powder of new materials," "I want to prevent product defects with powder that has no oxide coating," and "I want to use high-quality metal powder"! ★ We also offer contract manufacturing, so please feel free to consult with us! ★ 【Main Applications】 Solder powder (melting point: approximately 180°C) is used as solder paste for printing on printed circuit boards and for soldering fine components. It is also recommended for manufacturing materials for metal 3D printers. Recently, there has been an increasing demand for fine powders made from high melting point metals. *For more details, please "download the catalog" or "contact us" below.*
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basic information
【Target Metals】 ■ Solder ■ Aluminum ■ Zinc ■ Tin ■ Iron Alloys ■ Copper, etc. 【Features】 ■ Powder particle size can be produced from 5μm to 350μm. ■ Can accommodate micro-powders from high melting points (below 1650°C) to low melting points (below 450°C). ■ By controlling the melting temperature and disk rotation speed, the quality of particle size becomes uniform. ■ Produced in an oxygen-free state, allowing for the manufacture of powders without oxide films. * Contract manufacturing is also available. Please feel free to consult with us. * For more details, please download the catalog or contact us.
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Hampden powder (melting point: approximately 180°C) is used as solder paste for printing on printed circuit boards and for soldering fine components. Recently, there has been an increasing demand for high melting point metals in fine powder form.
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We propose facilities that take into account the optimal working environment and surrounding areas.
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