For waterproofing and dustproofing of electrical components. Hot melt molding.
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!
"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.
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basic information
Our company provides comprehensive support from the initial technical discussions and prototype production and evaluation, to the examination of optimal processes for mass production, equipment proposals, design and manufacturing of dedicated machines (automated systems), supply of resin materials, and line support. Additionally, for customers who find it difficult to introduce equipment, we offer contract manufacturing services at our factory. We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even if it's just for a tour.
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Detailed information
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Case Studies of Hot Melt Molding Adoption (Total 16 pages, 15 cases) Includes numerous examples where switching from potting to hot melt molding has reduced processing time and led to cost savings.
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Automotive Parts Application Case Studies (Total of 5 pages, 6 cases) Examples applied in the automotive industry and automotive parts industry are included.
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Mobile Device Application Case Studies (Total of 3 pages, 2 cases) Examples of applications in the mobile device manufacturing industry are included.
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Hot Melt Molding Technical Documentation (Total of 10 Pages) Includes know-how on hot melt molding and waterproofing of substrates and electronic components, along with comparisons and advantages over conventional methods.
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[Technical Document] Achieving VA through Switching from Potting A technical document featuring know-how on achieving VA by switching from potting to hot melt molding, explained clearly with three case studies.
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Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.