We will be exhibiting at Automotive World 2018.

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

https://youtu.be/md3oISRYXLI?si=Plg35_A18l1Oemh_

In this webinar, experts in immuno-oncology, digital pathology, and clinical oncology will gather to discuss how spatial biology and advanced image analysis are transforming cancer research and healthcare. The speakers will present how multiplex immunofluorescence workflows and deep learning analysis have enabled the identification of immune niches related to treatment response, and how this approach can be extended to other cancers.

We exhibited our electromagnetic wave shielding "Y-Shield" at the "5th Sustainable Materials (SUSMA)" held at Makuhari Messe from November 12 (Wednesday) to 14 (Friday), 2025. Thanks to everyone, we were able to conclude the exhibition successfully. We acknowledge that there may have been some shortcomings at the venue. If you have any requests that we were unable to address on the day or any questions regarding our information, we would appreciate it if you could contact our representative or reach out through the "Contact Us" form on our website. We will continue to strive to meet your expectations, and we kindly ask for your continued support. [Exhibition Overview] Exhibition Name: 5th Sustainable Materials Exhibition within High-Function Materials Week [Tokyo] Official Website URL: Sustainable Materials Exhibition [Tokyo] | November 14-16, Makuhari Messe Venue: Makuhari Messe (within the booth of Maruzen Pharmaceutical Industry Co., Ltd.) Exhibition Period: November 12 (Wednesday) to 14 (Friday), 2025 Main Exhibit Content: Electromagnetic wave shielding processing utilizing plating technology.

If you are not familiar with the field, understanding the "demands from the field" will remain at the level of "problem incidents," and you will be unable to pursue the "root causes" of these incidents, leading to responses that are specific to each problem incident. If the IT department is responsible for creating systems across the company, it is necessary to acquire both ICT technology and an understanding of "the business content of the field and the ideal state of operations from a company-wide perspective." In other words, it is essential to have business knowledge, management techniques, analysis, design, establishment, and effectiveness measurement techniques, as well as data construction techniques that guide various standards and standardization. The first step is "business knowledge." First, you will acquire business knowledge and learn the ability to "understand" the demands from the field. You will prepare for the next theme, which is "learning management techniques to understand the ideal state of operations from a company-wide perspective." This course serves as a practical introductory course to that entry point.

By taking this course, you will be able to construct a BOM and set reference values. You will acquire the skills to set a BOM that includes process steps and the reference values for achieving DX.