We will be exhibiting at Automotive World 2018.

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

The latest published paper utilized Abby. This will be an online seminar featuring Associate Professor Yosuke Katsuta from the Graduate School of Advanced Science and Technology, Kumamoto University, who is also a co-founder of StapleBio. He is working on RNA hacking technology development aimed at altering the higher-order structure of target mRNA using short nucleic acids named Staple nucleic acids, with the goal of controlling gene expression. He will present the latest data focusing on the results of cell experiments and animal experiments in the development of this technology. Related paper on the lecture content: "Staple oligomers induce a stable RNA G-quadruplex structure for protein translation inhibition in therapeutics" | Nature Biomedical Engineering

[Speaker] Yoshirō Tsuruhara, Representative of Auto Insight Inc. / Technology Journalist and Editor [Key Lecture Content] The global automotive industry is undergoing significant upheaval. The term "CAST," which is bringing about even greater changes than the previously used keyword "CASE," is at the forefront. It stands for four elements: "China," which has begun to lead global automotive technology; "AI" (Artificial Intelligence), which is transforming the development process; "SDV" (Software Defined Vehicle), which is revolutionizing the creation of vehicle value; and "Trump," which is altering the rules of the world. What does the future of the automotive industry look like with CAST? [Lecture Items] 1. Current state of the automotive industry 2. The keyword "CAST" symbolizing transformation and its meaning 3. How China is dismantling the old order of the automotive industry 4. Generative AI infiltrating all development processes 5. How SDV is transforming "value creation" in the automotive industry 6. How the second Trump administration will change the rules of the global automotive industry 7. Changes in how the automotive industry generates revenue 8. Q&A

[Lecture Items] 1. Energy-saving Project for Data Centers National Research and Development Agency New Energy and Industrial Technology Development Organization Next Generation Green Data Center Technology Development Project Project Manager Toshiyuki Ando 1. About NEDO 2. Overview of the Next Generation Green Data Center Technology Development Project 3. Future of Data Centers 4. Elements Necessary for Energy Saving 5. Overview of Research and Development 6. Q&A / Business Card Exchange 2. Technology Trends of GaN Power Devices Expected to Contribute to Energy Saving in Data Centers and Other Industrial Applications Professor Noriyuki Iwamuro, Tsukuba University, Mathematical and Physical Sciences 1. Current and Future of the Power Device Market 2. Key Points in Power Device Development 3. Technologies Supporting the Latest Silicon MOSFETs 4. Why GaN Devices for Data Centers 5. Latest Technologies of GaN Power Devices 6. Differentiation Between GaN and SiC Power Devices 7. Q&A / Business Card Exchange

This is an announcement for a seminar hosted by our group company, Jemco Japan Management Co., Ltd. ■ Theme: "Mastering 'DX that Can Be Used on the Ground'! Business Reform in Management and Indirect Departments Utilizing DX" ■ Date and Time: November 12, 2025 (Wednesday) 14:00–15:00 ■ Format: ZOOM Webinar 【Seminar Content】 1. The 2030 Problem and Productivity Challenges in Management Departments 2. An Overview of Business Reform Utilizing Digital Technology 3. Automation of Routine Tasks with RPA (Power Automate) 4. Knowledge Search and Document Utilization with Generative AI × RAG 5. Implementation Examples of "Small-Scale DX" with Power Apps 6. Development of DX Talent and Internal Deployment Models If you wish to participate in the seminar, please apply using the URL below. (You will be redirected to the group company's site) *Please apply early as the registration will close once capacity is reached. https://www.jemco.co.jp/seminar/20251112dx/?lfpeid=kqbONicaYDDx&lfmaid=1000360919-5

At our booth, we will propose products that enable "improved production efficiency" and "cost reduction" through the stabilization of plastic molding. In particular, for recycled plastics, which have been gaining importance recently, the representatives of each device will explain the test results verified with demo machines conducted in-house. We will have a demo unit of the polymer moisture meter "AquaTrack V," and customers who bring samples will be able to conduct actual measurements. Larger samples, such as preforms, can also be measured as they are. *Please inquire in advance about the types of samples. Additionally, we will present a booklet titled "Dr. Plastic Molding's Rheology Lecture Notes," summarizing the understanding of material properties and predictions of viscosity and flowability, to those we speak with at the booth. We sincerely look forward to your visit. ◎ Exhibition Contents - Polymer moisture meter "AquaTrack V" (actual machine on display; demo measurements available) - Ultra-compact polymer dehumidifying dryer "Card Series" (full-size mock-up on display) - Capillary rheometer "R6000" (panel on display)