We will be exhibiting at Automotive World 2018.

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

Seiko Co., Ltd. will be exhibiting at the "11th Monozukuri World Nagoya" held at Port Messe Nagoya. This exhibition features approximately 630 companies showcasing advanced technologies that contribute to shortening development and manufacturing periods, promoting DX and IT, reducing costs, and enhancing energy efficiency and automation in factories, including IT and DX products, parts, equipment, devices, and measurement products. We plan to display the actual cabinet for equipment management, "SMART BEE," so please be sure to visit us. 【Model Numbers】 ■ Vending Machine Type Tool Management Cabinet Smart Bee X, Smart Bee S, Cute Bee, Smart Bee Pro ■ Locker Shelf Type Tool and Consumables Management Cabinet T Series: T57, T100, T108 TW Series (with electronic scale): TW45, TW68, Hyper S, Hive

We will be exhibiting at "Japan DX Week Spring 2026," which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday). At the Marble booth, we plan to showcase how AI can improve work efficiency and lead to business automation in on-site operations. Additionally, we will provide an opportunity to experience a demonstration utilizing the latest technology, AR. Furthermore, for our manufacturing industry customers, we will present proposals under the theme "Utilizing Drawings to Drive DX," promoting the digitalization of design and quality areas, and introducing packaged products and custom services aimed at enhancing productivity in the manufacturing sector.

Core systems are the foundational support for corporate management, and their importance is increasingly heightened in the DX era, where data becomes a source of competitive advantage. To respond swiftly and flexibly to the rapidly changing business environment, a transformation in the nature of systems is required. We will introduce a method to realize a highly flexible and scalable business system that promotes operational efficiency and data utilization through the combination of kintone and ASTERIA Warp, using examples and demonstrations.

The widespread adoption of generative AI is rapidly evolving from traditional "conversational AI" to "autonomous execution AI (AI agents)." The AI agents that have recently garnered attention are not limited to merely generating responses; they can incorporate an autonomous processing flow of "planning → task decomposition → execution → evaluation," serving as new partners that can substitute and expand users' business operations. In this seminar, we will clearly introduce the following topics, incorporating examples of the AI solution "AIdea Suite AGENT +plus" and the data integration tool "ASTERIA Warp": - Why "AI agents" are becoming essential for corporate competitiveness now - The mechanisms of AI agents and specific use cases - Methods for establishing business efficiency, creating new value, and gaining a competitive edge - Specific steps for implementing AI agents - Data integration and its methods, which are essential for utilizing AI *This is a re-broadcast of the seminar held on October 30, 2025 (Thursday).