We will be exhibiting at Automotive World 2018.

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

We will be holding the second webinar on aluminum foil, which received great acclaim last time. This is an opportunity to deepen your knowledge about aluminum foil, so please join us. 【Webinar Details】 Content: Introduction to the Manufacturing Methods and Functional Aluminum Foils vol.2 Date: February 20 (Friday) Time: 15:00 - 16:00 Participation Fee: Free How to Participate: A Zoom viewing URL will be sent to those who register by the day before. Capacity: 100 people 【Recommended for the Following Individuals】 - Those who have challenges related to metal foils or resin films - Those interested in joint research with foil manufacturers or new business development - Those interested in functional aluminum foils with high smoothness, high corrosion resistance, high strength, and luxurious designs ▼ Register here (Microsoft Forms) https://forms.cloud.microsoft/r/UA5g4N2fGU (dummy) ▼ If you have any further questions, please contact us at the email address below. foil-marketing@toyal.co.jp

This is a seminar introducing the new features of the latest version, Ver. 30, of the general-purpose 2D CAD system "EASYDRAW." Customers currently using EASYDRAW can achieve further efficiency and utilize convenient features by taking advantage of the new functionalities, so we encourage you to consider attending this seminar.

In aerospace, automotive, and other fields, rapid advancements in material development and manufacturing technology are being made to achieve further weight reduction aimed at improving fuel efficiency and reducing carbon dioxide emissions. This seminar will provide an easy-to-understand explanation for beginners about the trends in new material development at advanced companies that are energetically working towards ultra-lightweight solutions using lightweight materials such as carbon fiber, aluminum, and ceramics, as well as various additive manufacturing (AM) and manufacturing technologies and product case studies utilizing these materials through complex shape integration, lattice/honeycomb structure fabrication, porous structure fabrication, and topology optimization with 3D printers, which are impossible with conventional processing methods and technologies. The lightweighting of parts that can significantly differentiate from conventional and competitor parts is an urgent and critical issue, and intense technological development competition is unfolding both domestically and internationally. 3D printers, which are seen as the next-generation manufacturing method, offer a completely new perspective on AM technology, enabling the creation of innovative and attractive lightweight parts that are difficult to achieve with existing processing methods and technologies, as well as realizing short-term, low-cost, and high-quality manufacturing. Development cannot be expected to progress along the lines of existing technologies. By merging lightweight materials with 3D printing and utilizing topology optimization, astonishing weight reduction of parts can be achieved. We encourage you to take on this challenge.

At the beginning of this seminar, we will focus on the research and development related to ceramics 3D additive manufacturing that the National Institute of Advanced Industrial Science and Technology has been working on. We will discuss 3D additive manufacturing, powder preparation for manufacturing, debinding and sintering processes, as well as case studies of ceramics 3D additive manufacturing centered on alumina and reaction-sintered silicon carbide. Next, we will introduce Canon's latest developments in high-performance ceramic materials that significantly reduce "shrinkage" during sintering, which excel in selective laser melting (SLM) for 3D printers. We will also cover the characteristics of parts that can be manufactured using this method, layering technology, target fields, contract manufacturing services, and collaboration with Metal Research Institute, which has started high-precision semi-conductor part manufacturing services using metal 3D printers with these materials. After that, we will have advanced explanations from instructors of Shin-Toh V-Ceramics and As One about the development trends of various ceramics 3D printers from world-leading companies 3DCeram Sinto and Lithoz. We will discuss the latest additive manufacturing technologies that enable the creation of innovative parts, rapid part development, prototyping, and manufacturing, significant reductions in the number of parts, lightweight miniaturization, and reductions in manufacturing processes and workforce through the production of complex shapes, hollow and porous structures, and lattice structures that were previously impossible.

The complex shape manufacturing, integrated manufacturing, lattice/honeycomb structure manufacturing, porous structure manufacturing, hybrid structure manufacturing, direct manufacturing from 3D data, as well as topology optimization and collaboration with generative design, which were difficult with conventional processing methods and technologies, can lead to the creation of innovative aluminum parts that are not found in traditional or other companies. This includes rapid development, prototyping, and manufacturing of parts, dramatic reductions in the number of parts, ultra-lightweight and compact designs, and significant reductions in manufacturing time, costs, processes, and workforce. In this seminar, pioneering users such as J·3D, ODEC, and the pioneers of white copper, who are utilizing metal 3D printers to rapidly develop, prototype, and manufacture complex aluminum parts, will specifically explain the key points and precautions for introduction and utilization, various manufacturing methods and technologies, unique next-generation AM technologies developed in-house, and groundbreaking case studies that significantly differentiate their parts from those of other companies, sharing both success and failure stories. With the remarkable advancements in metal AM technology, the use of metal 3D printers for aluminum parts manufacturing will become commonplace in a few years. The secrets to success will be discussed by instructors with numerous research achievements and extensive manufacturing experience, providing clear and concrete lectures for those considering implementation, beginners with interest, and those who are new to the field.