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  1. Home
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  3. 松本加工
  4. [New Product Announcement] Thermal Conductive Hot Melt TC50
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  • Dec 21, 2017
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Dec 21, 2017

[New Product Announcement] Thermal Conductive Hot Melt TC50

松本加工 松本加工
We have received numerous requests for thermal conductive hot melt. We are pleased to announce a hot melt that achieves excellent thermal conductivity with a thermal conductivity rate of 0.65 W/m·K (300% compared to conventional products). It meets the requirements for both encapsulation and heat dissipation for control boards in drive systems and substrates for LED lighting. We will be distributing sample pieces at AUTOMOTIVE WORLD 2018. Date: January 17-19, 2018 Venue: Tokyo Big Sight, Booth No. E65-100 We look forward to your visit.
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For waterproofing and dustproofing of electrical components. Hot melt molding.

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

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Hot Melt Molding Case Studies Collection (All 26 Cases) & Technical Documentation

Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

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Hot melt molding machine for waterproofing and dustproofing of circuit boards - Matsumoto Processing

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

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Hot Melt Molding Case Study: "Waterproof Sealing of Printed Circuit Boards"

Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

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Waterproof sealing of the substrate: Achieving cost reduction as an alternative to two-component potting.

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

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【Waterproof Sealing of Circuit Boards】Hot Melt Adhesive for Molding ■■Matsumoto Processing■■

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

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Related catalog(3)

"Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated." Case studies on hot melt molding (automotive parts) ■Matsumoto Processing■

"Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated." Case studies on hot melt molding (automotive parts) ■Matsumoto Processing■

TECHNICAL
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"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." Case studies on hot melt molding. ■Matsumoto Processing■

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." Case studies on hot melt molding. ■Matsumoto Processing■

TECHNICAL
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"Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated." Technical document: Introduction to hot melt molding. ■Matsumoto Processing■

"Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated." Technical document: Introduction to hot melt molding. ■Matsumoto Processing■

TECHNICAL
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SPACECOOL and Ronseal Industries jointly exhibit at the "Hokkaido Energy Technology Innovation EXPO 2025" - Introducing solutions for the rapidly advancing heat countermeasures in Hokkaido.

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SPACECOOL Co., Ltd. is pleased to announce that it will jointly exhibit a booth with Ronsir Co., Ltd. at the "Hokkaido Energy Technology Innovation EXPO 2025," which will be held at Access Sapporo (Hokkaido) from October 8 (Wednesday) to October 9 (Thursday), 2025. Due to recent extreme heat, heat mitigation measures are also being sought in Hokkaido. At this exhibition, we will introduce heat mitigation strategies for buildings and outdoor equipment using SPACECOOL, along with actual implementation examples in Hokkaido, in collaboration with Ronsir Co., Ltd. Main Exhibition Content SPACECOOL Co., Ltd. - Explanation of SPACECOOL technology and introduction of actual implementation examples - Samples of SPACECOOL products (films, magnetic sheets, membrane materials, etc.) Ronsir Co., Ltd.: Innovation Proof RR - Actual model and implementation examples of the SPACECOOL integrated waterproof sheet "Innovation Proof RR" - Temperature sensation device for Innovation Proof RR Exhibition Overview Dates: October 8 (Wednesday) to October 9 (Thursday), 2025, 10:00 AM to 4:00 PM Venue: Hokkaido, Access Sapporo Our booth number: 405 (2 booths) *Advance registration is required for attendance (free).

Sep 09, 2025

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Solve your issues with wired bed exit sensors by connecting a wireless set linked to the nurse call system!

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Do you have any concerns or requests regarding wired bed exit sensors? × Tangling and tripping of wired cables × Cable disconnection or damage × Worry about forgetting to turn on the switch after temporarily stopping the sensor. × Want to be notified of bed exit even from a location away from the nurse call outlet. Such concerns can be resolved simply by connecting to a wireless set linked to the nurse call system! Our nurse call linked wireless set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed, alleviating concerns about tripping and falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations away from the nurse call outlet, allowing for more flexible equipment placement.

Sep 09, 2025

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PFAS Regulation Countermeasures! ■■ Leak Test Equipment for Small Electronic Components|MSA-0101 series ■■ Does not use fluorinated inert fluids. PFAS-free. Offers accuracy equal to or better than liquid immersion testing.

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● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Sep 09, 2025

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Hotron's vehicle detection sensors contribute to efficient parking management, from coin parking to large-scale parking lots.

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Hotron's vehicle detection sensors allow you to search for products that meet your needs in three categories: "Purpose of Use," "Location of Use," and "Product List." The sensors detect the passage of vehicles, alerting you with rotating lights or switching the display of parking availability. They manage vehicle presence, full parking, and exit warnings in parking lots, contributing to safe driving and smooth operational management within the parking area. They are used in various settings, from coin-operated parking to large-scale parking lots.

Sep 09, 2025

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[Cast Iron Crack] We will repair cracks in metal products without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Sep 09, 2025

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