Through-hole half-cut / slit / punching of low and high dielectric constant materials is possible with pressing!
At Nippon Micron Co., Ltd., we provide a variety of assembly substrates that enhance assembly efficiency by enabling pressing of special materials that are typically difficult to work with, thanks to our advanced mold technology. Our expertise in mold materials and structures allows us to achieve punching processing of fragile special materials, such as low and high dielectric constant materials. Additionally, when the thickness of the sheet is thin, the cross-section has less burr, allowing for improved precision. 【Features】 ■ Advanced mold technology ■ Achieves punching processing of low and high dielectric constant materials ■ Improved precision possible for thin sheet thickness *For more details, please refer to our catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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LED substrates, small modules, etc. *For more details, please refer to the catalog or feel free to contact us.
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Japan Micron focuses on the manufacturing of printed circuit boards and provides development and design assistance for various types of boards, including sensor boards and module boards, as well as some assembly. Utilizing patents, proprietary equipment, and unique technologies, we achieve diverse functionalities such as high density, miniaturization, heat dissipation, thinness, high-frequency characteristics, energy efficiency, and three-dimensionality, ensuring high reliability and producing products that meet our customers' needs.
