Printed circuit board material with a flexible insulating layer.
Rishorite printed circuit board material
Suitable for solder crack prevention.
Power devices, which are semiconductors for power conversion, and high-brightness LEDs generate significant heat, so they are mounted on printed circuit boards based on aluminum plates. In this case, when the aluminum plate expands or contracts due to heat, it puts stress on the solder joints of the components. If this stress accumulates, it can lead to "solder cracks." The newly developed 7303 series resin remains very flexible even after curing, allowing it to absorb dimensional changes caused by the expansion and contraction of the aluminum plate. As a result, the stress on the solder joints is alleviated, helping to prevent the occurrence of cracks.
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basic information
The 7303 series resin developed this time is characterized by its remarkable flexibility even after curing. The adhesive sheet AD-7303 is provided with this resin sandwiched between PET film, and the resin layer is in its uncured state. Additionally, the aluminum base substrate material AC-7303 is created by placing this resin as an insulating layer on an aluminum plate and applying copper foil for circuit formation. The insulating layer is in its cured state. The 7303 series resin not only offers flexibility but also has a thermal conductivity of 3 W/mK and withstands a voltage of 6400 volts even at a thickness of 120 μm. Therefore, we expect it to be adopted for substrates used in electric vehicle power conversion, high-brightness LED substrates for various lamps, and substrates for automotive equipment placed in harsh environments such as engine compartments.
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Applications/Examples of results
Power device substrates, power LED substrates, substrates for automotive equipment placed in harsh environments.
Detailed information
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Solder cracks and their countermeasures (image) When an aluminum plate repeatedly expands and contracts, stress accumulates at the soldered joints, leading to cracks. The 7303 series resin is flexible, allowing it to absorb expansion and contraction, thereby suppressing the occurrence of cracks.
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Configuration of AD-7303 We provide the 7303 series resin before it is thermoset, sandwiched between PET film.
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Configuration of AC-7303 It is a printed wiring board material with a flexible insulating layer placed on an aluminum plate, and a copper foil for circuit formation applied on top of it.
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Solder Crack Resistance Test A sample with chip resistors sized 3225 mounted with lead-free solder was prepared and subjected to an alternating environment of minus 40°C for 30 minutes and plus 125°C for 30 minutes, repeated 1000 times. The solder joints were then photographed using an electron microscope. The left side shows AC-7303, and it can be observed that no solder cracks have occurred.
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Application with Curved Surfaces The AC-7303 has a flexible insulating layer, so the circuit will not break even if a certain degree of curvature is applied. This is expected to make it suitable for applications that require design aesthetics. Sample provided by: Techno Electronics Co., Ltd.
Line up（2）
| Model number | overview |
|---|---|
| AD-7303 | High thermal conductivity adhesive sheet |
| AC-7303 | Aluminum base substrate material |
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
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