Compact design yet maintains performance! A sputtering device capable of substrate heating at high temperatures.
The "SS-DC・RF301" is a compact sputtering device equipped with one 2" magnetron cathode and a substrate heating mechanism. Thanks to its simple design, it can be installed in about half the space of an office desk. It employs a substrate up-and-down mechanism, allowing for adjustable distance between the target and the substrate. In addition to being able to heat the substrate at high temperatures, it can also operate using only electricity and gas, and allows for reconfiguration between sputter-up and sputter-down. 【Features】 ■ Space-saving with a simple design ■ Adjustable distance between the target and the substrate ■ Capable of high-temperature substrate heating ■ Standard equipped with a chiller *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
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【Specifications】 ■Achievable vacuum level: 1×10^-4 Pa or lower ■Leak rate: 1×10^-8 Pa·m3/sec or lower (excluding O-ring permeation) ■Exhaust system: TMP + diaphragm pump (or rotary pump) ■Vacuum gauge Full-range vacuum gauge (cold cathode + Pirani gauge) + capacitance gauge (optional) ■Substrate stage: 2-inch compatible stage ■Substrate heating temperature: MAX 500℃ (can also support MAX 800℃ as an option) ■Main body stand: with casters and adjusters (including power supply) *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
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In 1972, the first president, Horita, established Taisei Sangyo Co., Ltd. using the entrance of his home as a workplace, and since then, we have been dedicated to technology development and research. Initially, we were involved in the development of devices such as the Polack counter for the Meteorological Research Institute, starting our work in the field of atmospheric science. Subsequently, we expanded our work into the vacuum world by starting maintenance services for leak detectors. Around the 10th anniversary of our founding, work in ultra-high vacuum began to increase, and by the 15th anniversary, we were able to manufacture small devices. Currently, our scope of work has significantly expanded, not only covering ultra-high vacuum, MBE, CVD, ECR, and RF radical sources, but also advancing the development of functional components utilizing various plasmas, ions, or electrons. In the future, we aim to become a small enterprise that can truly compete in the world of cutting-edge technology.