High-purity insulating materials for the purpose of sealing semiconductor chips!
The "Underfill for Chipon Film" is one type of bare chip mounting, where the circuit side of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate. It is a chip coat that is injected and sealed using a capillary flow type. Among insulating materials, it has good injectability into narrow gaps and excellent moisture resistance, and it is a material compatible with flexible substrates, mainly used in mounting substrates for LCD drivers and similar applications. 【Features】 ■ One type of bare chip mounting ■ Insulating material for sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability into narrow gaps ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.
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Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.