High-purity insulating materials for the purpose of encapsulating semiconductor chips!
The "Underfill Material for CSP/BGA Board Level" is a reinforcement material designed to improve impact resistance and heat cycle durability when secondary mounting packaged bare chips onto a motherboard. It is a capillary flow type material that is injected and sealed, characterized by high reliability and high productivity. 【Features】 ■ Insulating material for injecting and sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability for narrow gaps ■ High reliability, high productivity, and high moisture resistance *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■SUF 1589-1: High reliability and high productivity ■SUF 1570-2: High reliability and high moisture resistance *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.