From prototype development to mass production! Ensuring high yield with manufacturing technology.
Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Lineup】 ■ Submicron-compatible high-precision bonding device "FINEPLACER lambda" - Diversified processes and development technologies - Immediate device compatibility - Easy upgrades with a modular system - High cost performance ■ Fully automatic high-precision bonding device "FINEPLACER femto 2" - Fully automatic operating environment - Highly reproducible processes - High-speed throughput compatibility - Compatible with various mounting technologies such as eutectic soldering, adhesive methods, etc. 【Supported Processes】 ■ Thermal compression bonding ■ Thermal/ultrasonic bonding ■ Ultrasonic bonding ■ Eutectic soldering (AuSn, indium, C4) ■ Adhesive methods ■ UV/thermal curing ■ Bump mounting ■ Cu pillar mounting ■ Mechanical assembly *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Flip Chip Bonding ■ High Precision Die Bonding ■ Laser Diodes, Laser Bars ■ Optical Engines, VCSEL/PD ■ LED Bonding ■ Micro Optical Component Assembly ■ MOEMS *For more details, please refer to the PDF document or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.