Leave the punching processing to us!
Sanko Giken Co., Ltd. is a company that primarily engages in precision press processing (stamping, bending, cutting) of substrates, precision printed materials (etching), non-ferrous metals, films, resins, and more. We have a specialized team that can handle not only large lots but also small lot custom products. With your excellent products and our manufacturing technology, we will assist you in developing products with strong competitiveness. We provide a total service for all processing related to punching, taking into account all required specifications and final target costs. 【Business Activities】 ■ Precision press processing (stamping, bending, cutting) of substrates, precision printed materials (etching), non-ferrous metals, films, resins, etc. ■ Precision assembly work ■ Inspection processes *For more details, please download the PDF or feel free to contact us.
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【Products Handled】 ■ Wiring boards for mobile phones, digital cameras, computers, etc. ■ Antennas for IC cards ■ Diffusion sheets for backlights (LCD) *For more details, please download the PDF or feel free to contact us.
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In mold technology, we established a mass production method for copper heat dissipation substrates for power semiconductors in 2012. Products made of laminated copper and heat dissipation resin are not allowed to have any burrs on the cross-section, requiring strict processing cross-section quality and management capabilities. Therefore, we successfully developed and introduced molds using sintered diamond, making our manufacturing technology the key to product realization. Additionally, we have consolidated daily process management, such as micro-observation records of cross-sectional shapes, a quality assurance system that allows for full inspection by inspectors and automatic visual inspection machines, and a production management system that directly supplies to end users, proudly positioning ourselves as a "trusted processing partner."
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