Metal thin films are formed from roll to roll on various substrates.
At Kawamura Industries, we perform sputtering processing of copper, nichrome alloy, and chrome onto various substrates. If greater adhesion is required, we can suggest using our plasma treatment as a pre-treatment. **Features of Kawamura Industries' Sputtering Processing** - Roll to roll sputtering processing → Example of copper sputtering: thickness 0.1 to 0.2 μm - Capable of continuous film formation with different metal types → Multiple cathodes used - Supports sputtering of copper, nichrome alloy, and chrome *Please consult us regarding target materials other than those listed above. *For more details, please refer to the PDF materials or feel free to contact us.
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【Base Material Dimensions】 ■Maximum Base Material Width: 600mm 【Effective Width】 ■Maximum Effective Width: 500mm *For other conditions, please refer to the PDF document or feel free to contact us.
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Our company specializes in insulation processing, electronic materials, and microfabrication, achieving high quality, high performance, and timely production through high technology and refined skills.