We manufacture at our "domestic factory" armed with the reliable technology and high quality accumulated over many years of LSI production.
Kyushu Nichisei Electric Co., Ltd. offers contract manufacturing of semiconductor packages. We can flexibly accommodate from prototypes and small lots to mass production, so please feel free to contact us with your requests. 【Package Lineup】 ■DIP ■SHDIP ■QFP ■TQFP ■LQFP ■QFN, BGA (Prototype Line) *For more details, please download the PDF or feel free to contact us.
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【Contracted Process Flow】 ~Wafer provided by the customer~ 1. Wafer mounting 2. Dicing 3. Assembly and resin sealing 4. Exterior plating 5. Finishing (singulation) 6. FT 7. Inspection and packaging 8. Shipping ~Delivery to the customer~ *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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At Naito Densou Group, we aim to be our customers' best partner by providing semiconductor turnkey services ranging from LSI circuit design to package assembly and reliability testing. Among these, Kyushu Nissei Electric is responsible for packaging to final testing, responding to customer needs with the technology and know-how cultivated as a partner of major semiconductor manufacturers.
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