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  6. UV picosecond hybrid laser

UV picosecond hybrid laser

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LDH-V1610

last updated:Oct 04, 2022

スペクトロニクス
スペクトロニクス
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355nm picosecond laser sample processing now accepting!

The LDH-V1610 is a high-output UV picosecond laser with a two-stage solid amplifier configuration. The 355nm wavelength is suitable for processing materials such as glass, resin, and ceramics, enabling various operations like drilling and cutting with high quality.

    Other processing machines
LDH-V1610.png

UV picosecond hybrid laser

LDH-V1610.png
LDH-V1610.png
  • Related Link - https://www.spectronix.co.jp/product/2431/

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basic information

**Beam Characteristics** Wavelength: 355nm (UV) Average Output: >16W Repetition Frequency: 200kHz~1000kHz Pulse Width: <15ps Beam Diameter: φ1.8±0.5mm Divergence Angle: <0.5 mrad (full angle) Mode Quality: M2<1.4 Spatial Mode: TEM00 ● High Pulse Energy By incorporating a solid-state amplifier in a dual configuration within the mechanism, it enables high output and stable high pulse energy, allowing for efficient and rapid processing such as drilling and cutting. ● Pulse Split Mode In pulse split mode, the low repetition frequency can be controlled, enabling processing from a single shot. ● High-Speed Processing Multi-pulse mode (burst mode) allows for processing by subdividing the pulses.

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Applications/Examples of results

- Laser microprocessing - Cutting - Scribing - Thin film removal - Drilling - Trimming - Repairing - Marking - Material joining - Submicron processing

Detailed information

  • fron

    Processing Example 1: Drilling Holes in Si Wafers

  • 銅1.png

    Processing Example 2: Copper Dimple Processing

  • PTFEの切断1-1.png

    Processing Example 3 Cutting of PTFE

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Pico-second pulse laser oscillator product lineup

Pico-second pulse laser oscillator product lineup

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スペクトロニクス

スペクトロニクス

Industrial Electrical Equipment

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We provide picosecond laser oscillators as light sources with various wavelengths: green (532nm), ultraviolet (UV: 355nm), and deep ultraviolet (DUV: 266nm) for laser devices used in semiconductor and packaging substrates, semiconductor manufacturing and inspection equipment, and fine processing of electronic components (mainly drilling and patterning). We also offer proposals, development, and sales of optical systems necessary for equipment integration.

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