Plastic processing contact point
At Yamaden Co., Ltd., we cater to all needs in complex resin cutting processing. We collaborate with resin material manufacturers to propose optimal materials. We also accommodate injection molding for small lots starting from 10 pieces, allowing us to choose processing methods according to the usage period and application of the parts. We have a unified order and logistics system (YEMCO) across our five locations in Japan, ensuring high quality and short delivery times while considering the strengths and delivery schedules of each Yamaden factory. 【Business Activities】 ■ Sales and processing of plastic materials ■ Injection molding ■ Design and manufacturing of electronic devices *For more details, please download the PDF or contact us.
Inquire About This Product
basic information
【Features】 ■ Leave the entire production of plastic products, from design to assembly, to us. ■ Capable of machining and molding 99% of commercially available resin materials. ■ Small lot production possible from one piece for machining and from ten pieces for injection molding. ■ Cut unnecessary procurement routes to realize cost advantages. ■ Extensive experience in overseas procurement of molds. *For more details, please download the PDF or contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or contact us.
catalog（1）
Download All Catalogs
Company information
Yamaden Co., Ltd. has been in business for 50 years. We specialize in resin cutting processing for semiconductors, medical devices, food, electronics, automobiles, aircraft, shipbuilding, and space-related components. We respond to customer needs in both low-volume and mass production injection molding. We also have extensive experience in overseas procurement of molds. Please feel free to consult us starting from a single prototype.
![Attention those struggling with deadlines! Resin prototype manufacturing [Injection Molding]](https://image.mono.ipros.com/public/product/image/ad9/2001050414/IPROS82072984778877568109.jpeg?w=280&h=280)
![Resinization of HMI, HUD, and clusters, reduction of component count [heat dissipation, EMC]](https://image.mono.ipros.com/public/product/image/2100213/IPROS6494574281949856507.png?w=280&h=280)