A single blade consists of three layers, a Reed original technology!
The blade consists of a three-layer structure, with coarse diamond particles in the center layer to provide high grinding capability, and fine diamond particles in the side layers that contribute to the finishing quality. This design enables high-quality cutting processing while ensuring processing speed. Additionally, adjustments to the diamond concentration in the center and side layers, as well as modifications to the bond composition, allow for a design that minimizes the tapering of the blade.
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basic information
For more details, please refer to the catalog. Feel free to contact us as well.
Price range
P2
Delivery Time
Applications/Examples of results
〇 Cutting processing of semiconductor packages 〇 Cutting processing of composite materials
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Company information
Lead Co., Ltd. is committed to contributing to the realization of humanity's dreams in the field of ultra-precision machining, which serves as the foundation for next-generation industries. We continue to strive for the development of untapped technologies. Today, high technology is advancing based on electronics, progressing towards high-speed and high-capacity software, computers, and communication devices. Its applications are making remarkable strides in robotics, process technology, and the aerospace industry, extending even to cutting-edge nanotechnology. In this next-generation industry, which is moving towards knowledge-intensive fields, the research, development, and practical application of new materials, led by fine ceramics, have made significant progress, and the corresponding advancement of processing technologies is urgently needed. Please pay attention to Lead's power as we take on the challenges of the world of nanotechnology.
