From research and development to production! We demonstrate high quality and high versatility.
The "MODEL58 Series" is a wire bonder designed for low-cost research and development, prototyping, and small to medium-scale production. It demonstrates high quality and versatility, boasting a production speed of 1 wire per second despite being a tabletop device. Additionally, it can accommodate different bonding applications by switching the bond head. 【Features】 ■ High cost performance ■ Full automatic bonding process support with automatic pattern recognition function ■ User-friendly graphic user interface ■ High reliability and flexible pattern recognition capabilities *For more details, please refer to the PDF document or feel free to contact us.
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[Various Bond Heads that can be Mounted and Replaced] ■5810 - Ball Bonder ■5830 - Wedge-Wedge Bonder ■5832 - Deep Access Ribbon Bonder ■5850 - Thick Wire Bonder ■5850HR - Thick Ribbon Bonder *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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At Eltech Co., Ltd., we provide semiconductor manufacturing equipment utilizing cutting-edge technology, including wire bonders, ultrasonic oscillators, and bonding tools. We offer a range of products starting with the tabletop semi-automatic wire bonder "MODEL 56i series," as well as the MODEL 53 series manual wire bonder for research and development/small-scale production purposes, and the M17 automatic wire bonder for production applications. Please feel free to contact us if you have any inquiries.