エルテック Product Lineup

This product is a motorized XYZθ-axis pull tester developed for fine and thick wires. It is equipped with an automatic report output function and flexible data output capabilities via USB/WiFi/LAN/Bluetooth. Additionally, it features easy operability through a mobile user panel based on ergonomic design. 【Features】 ■ Work area: 40×40mm ■ Z-axis motor operating range: 40mm ■ Maximum component size (XY): 200×150mm ■ The height of the head can be adjusted within a range of 0-80mm to accommodate various device sizes. *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The "ODS 20" is a testing device used to measure the amplitude of tools used in wire bonders and die bonders. Not only does it measure the amplitude of bonding tools, but by equipping a load cell in the amplitude measurement sensor section, it can also measure the bonding weight. As before, the tool is set within a safe visible red laser, and the amplitude of the tool is measured. The measured values are digitally displayed on the screen. 【Features】 ■ Measures the amplitude (μm) of the wedge/capillary of wire bonders and the collet of die bonders. ■ By equipping a load cell (optional), it measures the bonding weight values. ■ Displays measurement results digitally on a graphic LCD display. ■ By installing software on a PC, it improves bond quality through the supply and management of measurement data. ■ Adopts a dual professor system, enabling communication interface with the bonder. ■ Due to non-reflective measurement, installation and measurement can be performed quickly compared to laser Doppler. *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The "M17 Series" has been developed with the concept of providing flexibility to the equipment, enabling upgrades and modifications at low costs to meet the demands of advanced and evolving technological requirements. As a result, it can adequately support each user's market development. The hardware and software are designed to allow the introduction of various wire bonding technologies and transducer frequencies on the same machine base, enabling other wire bonding processes as well. Additionally, it can perform deep access (DA) for gold ribbon wire. 【Features】 ■ Over 600 input, process, and output parameters ■ Creation of new bond programs in the shortest possible time using panorama pattern recognition ■ Excellent processing through structural algorithms for various patterns and critical surfaces ■ Lightweight linear motor X/Y table and a new high-speed motion system ■ A machine frame that reduces vibration with a sophisticated, smaller footprint *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The "MODEL56xx series" is a versatile bonder that can automatically perform wire bonding and pull/share tests, despite being a tabletop model. It is suitable for users who find bonding difficult with manual machines and do not require the production volume of fully automatic machines. Various optional features, such as automatic recognition and monitoring of wire deformation during bonding, can be easily added. 【Features】 ■ Diverse functions (6 in 1 Unit all-in-one) ■ User-friendly software ■ High flexibility ■ Wide work area ■ Various optional features *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The "MODEL53 Series" is a wire bonder that allows for switching between wedge bonding and ball bonding without changing the head. It is equipped with flexible bonding capabilities, a variety of loop control functions, and a double clamp feature. With digital weight control and Y, Z motor drive, it offers easy operability. 【Features】 ■ Capable of both wedge and ball bonding ■ Y, Z motor drive ■ Easy operability ■ User-friendly system ■ Digital weight control *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The "MODEL58 Series" is a wire bonder designed for low-cost research and development, prototyping, and small to medium-scale production. It demonstrates high quality and versatility, boasting a production speed of 1 wire per second despite being a tabletop device. Additionally, it can accommodate different bonding applications by switching the bond head. 【Features】 ■ High cost performance ■ Full automatic bonding process support with automatic pattern recognition function ■ User-friendly graphic user interface ■ High reliability and flexible pattern recognition capabilities *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment