Digital display on the screen! Measuring the amplitude of tools used with the wire bonder.
The "ODS 20" is a testing device used to measure the amplitude of tools used in wire bonders and die bonders. Not only does it measure the amplitude of bonding tools, but by equipping a load cell in the amplitude measurement sensor section, it can also measure the bonding weight. As before, the tool is set within a safe visible red laser, and the amplitude of the tool is measured. The measured values are digitally displayed on the screen. 【Features】 ■ Measures the amplitude (μm) of the wedge/capillary of wire bonders and the collet of die bonders. ■ By equipping a load cell (optional), it measures the bonding weight values. ■ Displays measurement results digitally on a graphic LCD display. ■ By installing software on a PC, it improves bond quality through the supply and management of measurement data. ■ Adopts a dual professor system, enabling communication interface with the bonder. ■ Due to non-reflective measurement, installation and measurement can be performed quickly compared to laser Doppler. *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Specifications (Excerpt)】 ■Purpose: Evaluation of bonding tool amplitude and weighted values ■Measurement details: Measurement of mechanical amplitude (Peak to Peak), frequency, and weighted values ■Power type: Plug-in power supply ■Input voltage: 100 - 240V AC 50/60Hz ■Output voltage: 12V DC ■Operating current: Max 1.0A ■Laser sensor: 64.0mm(W)×21.0mm(H)×15.0mm(D) (40g) ■Main unit: 155.0mm(W)×90.0mm(H)×204.0mm(D) (1100g) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
At Eltech Co., Ltd., we provide semiconductor manufacturing equipment utilizing cutting-edge technology, including wire bonders, ultrasonic oscillators, and bonding tools. We offer a range of products starting with the tabletop semi-automatic wire bonder "MODEL 56i series," as well as the MODEL 53 series manual wire bonder for research and development/small-scale production purposes, and the M17 automatic wire bonder for production applications. Please feel free to contact us if you have any inquiries.
