A SPI inspection device capable of detecting a wide range of defects with realistic images and 3D data!
The "KY8030-3" is an SPI inspection device that achieves true 3D inspection without worrying about uncertainties caused by shadow issues. It allows for real-time measurement and correction of warping of the substrate against an ideal plane, as well as real-time matching of the positions of PCB pads defined by CAD files in the ideal PCB stencil design. Additionally, it enables extensive defect detection using realistic images and 3D data. 【Features】 ■ Real-time warping correction ■ User-friendly software ■ SMT process management system with a 3D database *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Main Specifications (Excerpt)】 <Inspection Items> ■ Camera Resolution: 10µm, 15µm, 20µm ■ Camera: 4M Pixel High-Speed Camera ■ Height Measurement Accuracy (based on Koyon standard target): 1µm ■ Maximum Pad Size: 10×10mm ■ Maximum Pad Height: 400μm ■ Minimum Pad Spacing: 100μm (based on 150μm pad height) ■ Influence of Substrate Color: None *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Production site *For more details, please refer to the PDF document or feel free to contact us.
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Our company values human resources and has practiced sound management as the foundation of our customers' trust, leading to our growth. We cherish the connections between people and have decided to continue existing as a company recognized by our customers for our significance. The world is changing, and at a considerable speed. We are considering letting go of our past successes. Following traditional methods will not create any new value. We will focus our efforts on things that others do not or cannot do, investing all our energy and resources into this. Even if we are small, we aim to become a company that earns greater trust and inspires our customers.