[Technology Introduction] Hot Melt Molding

Unique development of molds and molding units for hot melt! Molding is possible at low pressure and low temperature!

The hot melt molding of the Nakagawa Electric Group began with the supply of in-vehicle components for hybrid vehicles. Through repeated trial and error regarding materials, surface roughness, gate positions, and cooling circuits, we developed unique molds and molding units. Compared to conventional potting molding, our process allows for molding at low pressure and low temperature. Additionally, as a result of our unique research and development, we have minimized damage to circuit connections while enabling weight reduction and miniaturization. Furthermore, by using transparent materials, it is easy to check the circuit connections even after molding. 【Features】 ■ Molding at low pressure and low temperature ■ Minimizing damage to circuits *For more details, please refer to the PDF document or feel free to contact us.

Other optical partsOther machine elementsOther Auto Parts