Description of features and points to note. *We are currently handling Sn-Cu based products!
"Lead-free solder reflow" refers to the change from conventional solder to lead-free solder. There are many types available, including those that incorporate Bi (bismuth), In (indium), and Al (aluminum). Due to the RoHS directive enacted in 2006, the inclusion of lead in certain products manufactured and sold within the EU has been prohibited, leading to an increase in the transition to lead-free options. 【Features】 ■ Good wetting and through-hole performance ■ Excellent storage stability, making reprocessing easy after aging ■ Minimal variation in surface thickness *For more details, please refer to the PDF materials or feel free to contact us.
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【Types】 ◎Sn-Ag-Cu (Tin-Silver-Copper) system ◎Sn-Cu-Ni (Tin-Copper-Nickel) system ◎Sn-Zn-Cu (Tin-Zinc-Copper) system etc. ★Our company is currently handling Sn-Ag and Sn-Cu systems★ *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Our company operates as a specialized manufacturer of surface treatment for printed circuit boards. In particular, to respond to the recent demand for short delivery times, we offer same-day processing even for small quantities and a variety of products, and for urgent orders, we complete them while you wait. Of course, we also provide same-day shipping to remote areas. Recently, we have quickly introduced a lead-free solder dedicated leveling machine (made in Japan) to accommodate lead-free solder, which has been well received. If you are facing any issues with surface treatment for printed circuit boards, please feel free to consult us.