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  3. Scientific and Physics Equipment
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  5. Plating Equipment
  6. Low-phosphorus electroless nickel plating without sulfur-based additives.

Low-phosphorus electroless nickel plating without sulfur-based additives.

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last updated:Feb 21, 2023

エプテック
エプテック
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Sulfur (sulfur) free! It has become possible to maintain long-term solder wettability, which has been a concern until now.

By achieving "no use of sulfur-based additives," which was not possible with conventional low-phosphorus electroless Ni-P plating, it has become possible to maintain the long-term wettability of solder, which has been a bottleneck until now. Due to its excellent uniformity in film thickness, plating can be performed without variation even on shapes such as heat sink fins. 【Features】 - The phosphorus (P) content of the Ni coating is low at 2-4 wt%, resulting in minimal "nickel consumption" during solder joining, enabling highly reliable solder joints. - Since sulfur-based additives are not used, it can maintain long-term wettability of solder, and the resulting plating film has excellent discoloration resistance and acid resistance. - A high hardness coating of Hv680 can be obtained without post-plating heat treatment, providing excellent wear resistance. *For more details, please refer to the PDF document or feel free to contact us.

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2018-04-24_15h09_11.png

Low-phosphorus electroless nickel plating without sulfur-based additives.

2018-04-24_15h09_11.png
2018-04-24_15h09_11.png
  • Related Link - http://www.eptec.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/eptec/product/

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【Main Plating Coating Specifications】 ■Coating Composition: Ni: 96-98 wt% P: Ni2-4 wt% ■Hardness (Hv): Without Heat Treatment: 680 With Heat Treatment: 900 ■Crystal Structure: Microcrystalline *For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■ Parts that require soldering ■ Parts that require wear resistance but do not tolerate heat treatment after plating, such as copper and aluminum ■ Parts that require general corrosion resistance *For more details, please refer to the PDF document or feel free to contact us.

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Low-phosphorus electroless nickel plating

Low-phosphorus electroless nickel plating

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エプテック

エプテック

Manufacturing and processing contract

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Surface treatment technologies, including plating, have continuously advanced and developed as familiar technologies in our daily lives. It is said that gold plating was applied to ancient decorative items, including the Great Buddha of Todai-ji in Nara. The pure desire to adorn objects more beautifully and to maintain that beauty forever has remained unchanged from ancient times to the present. Moreover, modern surface treatment technologies are not limited to purposes such as decoration and rust prevention; they are applied in various industrial uses. For example, many needs, such as wanting to harden the surface of a product, enhance conductivity, or reduce friction coefficients, can be achieved relatively cost-effectively through surface treatment technologies primarily based on plating. Since its establishment, Eputec Co., Ltd. has responded to various surface treatment needs of the times, consistently pursuing technological and production innovation. The key phrase is "Innovation for Tomorrow." Eputec Co., Ltd. will continue to respond to increasingly sophisticated and diversified needs and contribute to society as a "value-creating company" through surface treatment technologies that pave the way for tomorrow.

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