It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.
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basic information
■Specifications Board dimensions 5 to 100 mm x 5 to 235 mm Chip size □1 to 20 mm Mounting accuracy XYZ ±1μm (3σ)
Price range
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Applications/Examples of results
Process ● ACF/ACP ● NCF/NCP ● Au-Sn (eutectic) ● Au-Au (ultrasonic) ● Solder bump Chip types ● Large chip - CMOS image sensor ● Fine pitch - driver IC ● Brittle materials - compound semiconductor ● Small chip - analog IC
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Company information
We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.
