We handle everything from circuit design to exterior design during the development stages and undertake comprehensive contract manufacturing services from mold production to parts procurement.
Our company has been engaged in OEM manufacturing of security equipment for about 30 years since its establishment. We handle everything from circuit design to appearance design during the development stage and continue to provide integrated manufacturing services from mold production to parts procurement. We also offer assembly manufacturing (including quality control) leveraging our 25 years of experience in mobile phone repairs (including failure analysis), so please feel free to contact us regarding small lot production.
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◎Securing factory space and reducing maintenance costs ◎Reducing personnel recruitment and labor management costs ◎Setting a long-term implementation period ◎Optimizing the contracting system ◎Improving productivity by utilizing external know-how
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◎Securing factory space and reducing maintenance costs ◎Reducing recruitment and labor management costs ◎Setting a long-term implementation period ◎Optimizing the contracting system ◎Improving productivity by utilizing external know-how
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
