A case study on solving the flow issues of encapsulation resin in semiconductor manufacturing is featured!
This document discusses the flow issues of encapsulation resin in semiconductor manufacturing. It introduces cases where "S.S. Coat" has resolved problems caused by poor mold release properties. 【Contents】 ■ Flow issues of encapsulation resin in semiconductor manufacturing - Mainly caused by poor flow of encapsulation resin - Mainly caused by poor mold release properties - Frequency of occurrence has increased due to high stacking ■ Cases where S.S. Coat has solved this problem ■ Further expectations for S.S. Coat to resolve this issue *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Case Study of Problem Solving】 Applied "G-560R-8.0" to the chip ↓ Improved flow of sealing resin ↓ ◎ Successfully prevented chip damage due to sealing resin! *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[Data] Issues with the flow of encapsulation resin in semiconductor manufacturing](https://image.mono.ipros.com/public/catalog/image_generated/01/5b4/424949/424949_IPROS244532441230961231_1.jpg?w=120&h=170)
Company information
Shinshowa Coat Co., Ltd. is a manufacturer of water-repellent and waterproof agents. We handle ceramic materials, pottery materials, ceramic silicone, industrial fluorine coatings, ceramic water-repellent agents, ceramic oil-repellent agents, ceramic waterproof agents, and ceramic glaze binders and controls.
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