What is a reliable eutectic bonding?
Texus Corporation inherits the die bonding technology of Nidec Tosok Corporation and is implementing automation of semiconductor manufacturing equipment, starting with die bonding, based on that technology. [Content] - Bonding using eutectic reaction in the die bonding process For more details, please download the materials and contact us.
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basic information
For more details, please download the catalog or contact us.
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Applications/Examples of results
Manufacturing and sales of automation equipment related to semiconductor manufacturing, including Daibonda.
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Download All Catalogs![[Process Report Presentation] Joining Using Eutectic Reaction](https://image.mono.ipros.com/public/catalog/image_generated/01/d08/426233/426233_IPROS4799217154703812392_1.jpg?w=120&h=170)
Company information
We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.
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