Supports rapid heating by laser! Specialized in the implementation of micro components.
The "EVASOL 3230 series" is a laser solder paste specially designed to accommodate the mounting of micro components. It uses a special activator that enables rapid heating implementation through light. This reduces slumping during heating and resolves issues with solder balls. Additionally, it prevents the reaction between the flux and powder. Even with minimal dispensing, it achieves high coating stability. 【Features】 ■ Designed specifically for micro components ■ Prevents solder balls ■ Stable dispensing *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 38-25, 38-20, 32-15 µm ■ Flux content: 14.0±0.5, 14.5±0.3% ■ Weight: 40g, 100g ■ Flux type: MIL-RMA ■ Halide content: 0.08-0.10% ■ Copper plate/copper mirror corrosion test: No corrosion ■ Insulation resistance test: 1.0×10^8 Ω or more *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applicable Examples】 ■ Chip components of 1608 or smaller ■ Smartphone camera modules, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.