We will eliminate the accumulation of chemical solution with a vacuum nozzle.
Simultaneous processing on both sides with original technology achieves the same finish. This allows for a 20-30% increase in productivity while simultaneously achieving high finish quality. *For more details, please download the PDF or contact us.
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basic information
Our unique vacuum technology eliminates the accumulation of chemical solutions on the surface of the substrate, effectively achieving a uniform finish on both the top and bottom sides.
Price range
Delivery Time
※It will vary according to specifications.
Applications/Examples of results
For more details, please download the PDF or contact us.
Company information
Our company contributes to the industry as a development-oriented and proposal-oriented enterprise, based on plating and etching technology. The VCP-type copper plating equipment was developed by our company in 1997, ahead of the industry (with a Japanese patent obtained), and has now become the global standard technology. Additionally, in etching, we have developed a two-fluid method that responds to cutting-edge miniaturization (with patents obtained in Japan, South Korea, Taiwan, and China), which is rapidly spreading in the industry. We will continue to strive for new technology development and provide it to the industry. Please feel free to contact us if you have any requests.
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