Metal reinforcement plate, offset processing, bonding processing.
Offset bonding processing example
From the offset processing of adhesive tape to the metal reinforcement plate, to the bonding process and complete curing.
Seiko Electric has many years of experience and know-how in the press processing of reinforcement plates to lamination processing. Depending on the application, we perform high-precision offset lamination processing using insulating/conductive adhesives on aluminum and stainless steel (SUS) reinforcement plates that have undergone press processing/etching, preventing adhesive overflow that could cause circuit malfunctions. In addition to reinforcement plate processing, we provide a consistent response from vacuum temporary lamination of supplied wiring boards and adhesive sheets to complete curing after cure, helping to reduce total costs. We have processing achievements in a wide range of fields, including automotive electrical components, smartphones, and camera modules for entertainment robots, so please feel free to consult with us. Product Information: - Precision die-cutting of tapes and films - Punching processing (press processing) - Vacuum lamination processing For more details, please contact us.
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basic information
【Material Sales】 ○ Thermosetting resin laminated sheets and molded plates ○ Thermosetting resin laminated round bars and pipes ○ GFRP pipes (custom products) ○ Insulation boards ○ Thermoplastic resins and general-purpose plastics ○ Engineering plastics (high-performance plastics) ○ Super engineering plastics (super high-performance plastics) ○ Copper-clad laminated boards ○ Adhesive and bonding tapes ○ Functional films ○ FPC materials 【Processing and Manufacturing】 ○ Precision punching processing (various laminated boards, plastic sheets, ultra-thin metal sheets) ○ Precision die-cutting of adhesive tapes and films ○ Precision cutting processing ○ NC router processing ○ Glass epoxy resin cutting processing (laminated boards, round bars, pipes) ○ Functional film lamination processing ○ Optical film curved surface vacuum lamination processing ○ Jig and device contract development ● For more details, please contact us or download the catalog.
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We have extensive experience in reinforcement plates for FPC or rigid-flexible substrates for automotive electrical components, smartphones, and camera modules for entertainment robots. Please contact us for more details.
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Company information
Seiko Electric Co., Ltd. was founded in 1947, shortly after the war. Initially, we only sold insulating materials, but in response to customer requests, we began to offer processing services such as cutting, bending, and laminating. By utilizing our sales and production bases both domestically and internationally, we have been able to provide comprehensive support for our customers' businesses through services ranging from material sales to planning, proposals, processing, and logistics. We continuously challenge ourselves with new technologies in various fields, including smartphones, tablets, display devices, automotive parts, robots, measuring instruments, wearable devices, medical equipment, aerospace, manufacturing equipment, and power electronics, responding to customer needs from material sales to resin processing, tape and film processing, and vacuum lamination processing. Additionally, leveraging our global network for sourcing materials from overseas and supplying materials to overseas factories, we support all phases of "manufacturing," from material procurement to prototyping and mass production, including proposals for transitioning to mass production at our factory in the Philippines after prototyping and small-lot production at our Shirakawa factory.
