Presentation of materials | Are you choosing the right abrasive for the material being processed?
We offer materials for wire saws, including documents that help select abrasives and related products suitable for the "processing methods × workpieces" of fine ceramic materials!
The grinding method to be selected varies depending on the processing method and the workpiece. This document is intended to respond to diverse needs with an optimal selection of "what materials to grind and how to grind them." If you have any questions such as "I don't know which grinding method is best...", please feel free to contact us. 【Examples of processing methods】 ■ Materials for wire saws ■ Materials for precision lapping processing ■ For diamond bonded abrasive processing ■ Materials for precision plastic processing ■ Materials for ultra-fine grinding wheels ■ Materials for precision coating processing ■ Materials for heavy electrical components ■ Materials for fine ceramics *For more details, please refer to the PDF document or feel free to contact us.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.