A polishing material suitable for those seeking "high purity, high processing efficiency, high dispersion, and scratch-free."
The "PLANERLITE" series is a polishing material used in CMP (Chemical Mechanical Planarization) technology incorporated into the planarization process of increasingly dense ULSI devices. It is developed with the basic concepts of high purity, high processing efficiency, high dispersion, and scratch-free performance. [Introduction to the PLANERLITE Series] ■ PLANERLITE-4000: Polishing material for SiO2 films (interlayer insulating films, STI) ■ PLANERLITE-6000: Polishing material for Poly-Si ■ PLANERLITE-7000: Polishing material for copper wiring used in damascene processes ■ PLANERLITE-8000: Polishing material for barrier metals used in copper wiring *For more details, please refer to the PDF document or feel free to contact us.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
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