Ceramic substrates and thin-film integrated circuits achieving miniaturization and high precision.
●Fine circuit pattern Line/Space: 30μm/30μm ●Pattern dimension accuracy: ±10μm
We form thin-film integrated circuits on various high-intensity, high thermal conductivity ceramic substrates. ● Side patterns (0.3t or more), and AuSn solder patterns ● Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors ● Circuit formation with low dielectric loss and low noise in the high-frequency range through the combination of our unique 99.9% alumina substrate and fine patterns ● Substrate materials: alumina, aluminum nitride, zirconia, quartz
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basic information
As a substrate manufacturer, we are able to provide comprehensive technology development, quality assurance, and problem-solving. We also respond quickly to short delivery times and design changes.
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Applications/Examples of results
- Submounts and subcarriers for photodiodes and laser diodes - Circuit boards for transmitters and receivers used in microwave and millimeter wave bands (amplifier circuits, frequency conversion circuits, oscillator circuits, filter circuits, etc.) - Small resistor arrays Circuit boards for measuring instruments Circuit boards for communication devices and radar - Circuit boards for sensor heads Components for synthesizers and splitters for optical submarine cables - Various types of circuit boards
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Company information
As a member of JGC Group, JFC challenges the possibilities of the material of fine ceramics with our own technologies. We actively engage in fundamental and applied research on ceramics, product application development, as well as manufacturing and sales. We respond to the diverse needs of various advanced industries with our unique technologies and products, including high-frequency ceramic substrates and circuit components, ceramic parts for industrial machinery, and the prototyping and development of metal-ceramic composite materials (MMC).
