Rishorite printed circuit board materials for automotive equipment

basic information

This is a printed circuit board material equipped with the necessary performance for each automotive device, such as high thermal conductivity, long-term heat resistance, low transmission loss, and resistance to solder cracking. There are also high thermal conductivity adhesive sheets for attaching substrates that house heat-generating components like high-brightness LEDs and power semiconductors to heat sinks.

Price range

Delivery Time

Applications/Examples of results

Printed circuit boards mounted in automotive equipment such as LED lamps, inverters/converters, millimeter-wave radar, engine control units, and optical sensors.

Detailed information

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  ▼CC-7210 This is a copper-based printed wiring board material for power conversion devices in electric vehicles, such as inverters and converters. The 7210 series resin arranged on the surface of the copper plate has a thermal conductivity of 10 W/mK and offers insulation reliability that withstands high voltages of 5000 volts even at a thickness of 0.12 mm. It also has high heat resistance with a Tg of 270°C. It provides heat dissipation effects equivalent to ceramic substrates while being offered at a lower price.

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  ▼CC-7208 is a sister product of CC-7210. By reducing the thermal conductivity of the insulating layer to 8W/mK, we can offer it at an even lower price.

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  ▼CS-3305A Electronic devices mounted in automobiles are subjected to high temperatures for extended periods, so "long-term heat resistance" is an essential requirement. CS-3305A is an ultra-high heat-resistant printed wiring board material with a Tg of over 300°C, and this performance is stably maintained over a long period. Additionally, it is less prone to warping even when heated in thin sheets, which reduces the likelihood of circuit disconnections. We recommend it for devices such as engine control units, ETC, car navigation systems, and dash cameras.

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  ▼CS-3305K is a sister product with performance equivalent to CS-3305A. It does not contain fillers in the resin, which enhances the embedding capability of the parts.

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  This is a printed circuit board material with the performance of "low transmission loss," meaning it can transmit signals faster and in greater quantities without attenuating high-frequency signals. It is expected to offer performance comparable to expensive PTFE (polytetrafluoroethylene) substrates, but at about half the price. We recommend its use for millimeter-wave radar substrates.

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  ▼AC-7303 This is an aluminum-based printed wiring board designed for electronic devices installed in harsh temperature conditions, such as those found outside the vehicle like headlights or in the engine compartment. The 7303 series resin applied to the surface of the aluminum plate remains very flexible even after curing. This flexibility absorbs the thermal expansion and contraction of the aluminum plate, making it less likely for stress to occur at the solder joints of the components, thereby reducing the occurrence of cracks.

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  CS-3667B is a high-heat-resistant black printed circuit board material designed to accommodate light-emitting and light-receiving elements of optical sensors. To prevent malfunction and sensitivity reduction, it is necessary to optically separate the light-emitting and light-receiving elements. CS-3667B not only shields visible light but also blocks light from red to near-infrared used in sensors, making it suitable for substrates that mount sensor components.

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  This is a printed circuit board material with a resin surface in white, designed with the incorporation of LED components in mind. Its thermal conductivity is approximately 1.3W/mK, which is about four times that of typical materials. However, when made into a 0.1mm thin sheet, it exhibits excellent "heat dissipation," sometimes exceeding expectations in heat dissipation performance, leading to many successful applications.

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  Copper foil with resin (left) and high thermal conductivity adhesive sheet. This is an adhesive with excellent thermal conductivity used to bond a substrate equipped with heating components to a heat dissipation plate. The adhesive sheet consists of a resin with excellent thermal conductivity and insulation reliability, sandwiched in a semi-cured (B-stage) state between PET films, while the copper foil coated with it is the copper foil with resin.

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