Heat-resistant tape made from half-cured heat-resistant polyimide film as the base material.
Heat-resistant tape made from half-dip heat-resistant polyimide film. It has excellent adhesive residue properties on glass and semiconductors. (171) Grades with light release properties (171) and strong adhesion (172, 174) are available.
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basic information
【Composition】 Polyimide film Silicone-based adhesive layer 【Features】 Heat-resistant tape based on heat-resistant polyimide film Excellent adhesive residue properties on glass and semiconductors. (171) Available grades with light release (171) and strong adhesion (172, 174) 【Applications】 171 Masking tape for glass in C-MOS camera modules, masking tape for C-MOS 175 Masking tape for glass in C-MOS camera modules, masking tape for C-MOS 172 Lead frame (temporary) fixing tape (medium adhesion) 174 Lead frame (temporary) fixing tape (strong adhesion)
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Applications/Examples of results
171 Glass for C-MOS camera module, masking tape for C-MOS 175 Glass for C-MOS camera module, masking tape for C-MOS 172 Lead frame (temporary) fixing tape (medium adhesive) 174 Lead frame (temporary) fixing tape (strong adhesive)
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Company information
Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials, including construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.
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