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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Nano-level precision high-precision polishing processing service

Nano-level precision high-precision polishing processing service

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last updated:Sep 27, 2019

匠研磨
匠研磨
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We can also control at the nano level! If you are struggling with polishing precision, leave it to us.

Our company offers internal grinding, external grinding, lapping, and various deburring services. External grinding for flat surfaces and outer cylinders can accommodate all kinds of needs. Additionally, internal grinding, which is said to affect the lifespan of parts, can handle fine holes down to approximately Φ0.3. Furthermore, you can trust us with lapping, also known as precision flat grinding, and deburring, which requires high-precision techniques. 【Features】 ■ External Grinding - Accommodates all kinds of needs ■ Internal Grinding - Capable of handling fine holes down to approximately Φ0.3 ■ Lapping - Achieves a mirror-like finish with micron-order and nano-level precision ■ Deburring - We have a proven track record of handling projects that other companies have declined *For more details, please download the PDF or contact us.

    Wafer processing/polishing equipmentProcessing Contract
キャプチャ.PNG

Nano-level precision high-precision polishing processing service

キャプチャ.PNG
キャプチャ.PNG
  • Related Link - http://www.takumikenma.jp/

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【Sales Area】 ■Nationwide Support *For more details, please download the PDF or contact us.

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匠研磨

匠研磨

Manufacturing and processing contract

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Our company performs internal polishing, external polishing, lapping, and various deburring processes. We assist in creating "things made by human hands" with skilled craftsmanship. We possess techniques and experience that cannot be replicated by other companies. From requests from major manufacturers to the polishing of a single part, we cater to all kinds of needs.

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